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Low Temperature Direct Bonding between PEEK (Polyetheretherketone) and Pt via Vapor-Assisted Vacuum Ultraviolet Surface Modification



Author(s)

Weixin Fu¹, Akitsu Shigetou², Shuichi Shoji¹ and Jun Mizuno^1,3

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DOI:10.17265/2161-6221/2017.3-4.001

1. Department of Nanoscience and Nanoengineering, Waseda University, 3-4-1 Okubo Shinjuku-ku, Tokyo 169-8555, Japan
2. National Institute for Material Science (NIMS), 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan
3. Institute for Nanoscience and Nanotechnology, Waseda University, 513 Tsurumaki-cho Shinjuku-ku, Tokyo 162-0041, Japan

Direct bonding between PEEK (polyetheretherketone) and Pt was achieved at 150 °C via a vapor-assisted VUV (vacuum ultraviolet) surface modification method. X-ray photoelectron spectroscopy confirmed that the PEEK and Pt outer surfaces were modified with hydrate bridge layers. A model calculation of gas content during VUV irradiation suggested that the water vapor molar concentration should be optimized to no more than 0.088 mol/m³. The strain energy release rate calculation indicated that the energy required to debond the PEEK-Pt interface reached 270 mN/m, which was higher than the energy required to break the bulk PEEK (42 mN/m). SEM observation of fractured PEEK-Pt bonding agreed well with the calculation result that the fracture occurred within PEEK substrate. Thus, the PEEK-Pt bonding was considered strong enough. This technology is expected to be applied in biomedical MEMS applications.

Vapor-assisted VUV, PEEK, heterogeneous bonding, hydrate bridge layer, surface modification, low-temperature bonding.